[History and development of optical Ethernet] 10GBASE transceiver module standard transferred from XENPAK → X2 → XFP → SFP + [Net new technology] – INTERNET Watch

2023-01-03 13:04:01 By : Mr. William Wang

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[History and development of optical Ethernet] 10GBASE transceiver module standard transferred from XENPAK → X2 → XFP → SFP + [Net new technology] – INTERNET Watch

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Regarding Ethernet or 10GBASE-T, since 2017 [10GBASE-T, finally popular?], we delivered all 11 episodes and 2 extra episodes.However, twisted pair copper wiring Ethernet is up to 10GBASE-T, and 25/40GBASE-T has not yet been put into practical use.

[Road to 10 Gbps access line] Although it may be partially covered, let's introduce "optical Ethernet" that uses optical fiber here.

As a matter of fact, the transceiver module standards used in 10GBASE are XENPAK → X2 → XFP → SFP+ in order of use.

In March 2001, the formation of the XENPAK MSA was announced.MSA stands for MultiSource Agreement and was not even an industry association.

As stated in the announcement, Agere System (a company spun out from the Microelectronics Group of the former Lucent Technologies) and Agilent Technologies signed a joint memorandum of understanding, but anyway, these two companies are the main focus. As a result, the standard proposal for the transceiver module standard for 10G Ethernet was issued.

According to the announcement, it supports four wavelengths: 850nm serial, 1310nm serial, 1310nm WWDM and 1550nm serial, with module dimensions of 38 x 121 x 17.4mm.The connector utilizes a 70-pin proprietary standard (provided by Tyco Electronics).

Since the connection with the host side is XAUI (below left), it uses the configuration on the right below that was posted last time.The control function side is relatively complete, and it is possible to monitor the operating status.

As for the power supply, a maximum of 6W can be supplied for modules with 850nm/1310nm light sources, and a maximum of 10W for modules with 1550nm light sources.However, the power supply itself is not a big problem, but the heat generation of the module due to this is more of a problem, and there is a description for that in the specification.

This XENPAK was initially used because there was no other standard.However, compared to SFP and the like, it was "big" anyway, so when the X2 came out, it declined like it was pushed.The XENPAK MSA itself has been mostly inactive after issuing its Rev 3.0 specification in September 2002, and its website existed until 2008, but has since become inaccessible.

In July 2002, the "X2 MSA" was formed.Members are Agere Systems, Agilent Technologies, JDS Uniphase, Mitsubishi Electric, NEC, OpNext, Optillion and Tyco Electronics.As you can see from the names of XENPAK MSA's Agere Systems and Agilent Technologies, as well as the names of Tyco Electronics, which provided connectors, it is essentially the successor standard to XENPAK.

The first specification, "Revision 1.0", was announced in February 2003.At this time, Ignis Optics, Molex Incorporated, Multiplex Inc, NTT, Pine Photonics, and TriQuint Optoelectronics joined as member companies, indicating that they were more active than the XENPAK MSA.

Now, about the X2, the specifications themselves are quite close to XENPAK.First, the connector itself uses the same Tyco 70-pin connector as XENPAK.In terms of electrical specifications, some XENPAK register values ​​are different (D.8032 register value from "00-80-BE" to "00-0C-64", D.8012 register value changed from "01" to "02"), otherwise they are completely the same.

In other words, there is no difference in that it is a connection using XAUI and supports four wavelengths of 850nm serial / 1310nm serial / 1310nm WWDM / 1550nm serial.

On the other hand, what is different is the mechanical shape.In addition to being smaller overall (roughly speaking, the volume is about half that of XENPAK), it is devised for wider use, such as attachment and detachment by rail (right), and support for PCI cards (lower right). Or is it something that has been properly specified?

Alternatively, a method for additional shielding of the connector section is described, and a method for enhancing the heat dissipation capability is also discussed.

In terms of cost, there didn't seem to be a big difference between the ZENPAK and the X2, but the volume was reduced somewhat, and the mechanical aspects were reviewed to make it easier to use, so around 2004 it was decided to replace the ZENPAK. Since then, the X2 has been used.

A third standard, XFP, was also formed in May 2002 by the XFP MSA.

It's almost the same timing as the X2, but the commercialization was a little behind the X2.The ten founding members are Broadcom Corporation, Brocade, Emulex Corporation, Finisar, JDS Uniphase, Maxim Integrated Products, ONI Systems, ICS (subsidiary of Sumitomo Electric Industries), Tyco Electronics and Velio, excluding connector manufacturer Tyco and optical connector JDS Uniphase. is quite different from XENPAK/X2.

However, since then, more member companies have participated, and if you look at the Contributors of XFP Revision 3.1, there are actually 75 companies listed.Most of the members of X2, such as Agere Systems, Agilent Technologies, Mitsubishi Electric, NEC, and NTT, were among them. .

XFP is a standard based on "XFI".As mentioned at the end of the last article, XFI is a 10Gbps serial communication standard.That's the interface between PMA and PMD at the bottom of the slide I posted last time.

And as you can see on the slide, it will be an independent standard unrelated to "IEEE 802.3ae".Perhaps because of that, XFP carefully defines this area.Basically, XFI has a structure that connects to the PMA on the host side with a two-wire system, as shown in the figure below.

In addition to 10G Ethernet, SONET, 10G FiberChannel, G.709, etc. are considered for signal speed, and multiple data rates from 9.95 Gbps to 11.09 Gbps are supported.

By the way, encoding supports 8b/10b, SONET Scrambled, NRZ, and RZ in addition to 64b/66b, but 10G Ethernet uses 64b/66b encoding.In the slides below, the subtle figure of 10.31 Gbps (10.3125 Gbps to be precise) for IEEE 802.3ae is because it is assumed that 64b/66b encoding will pass, so the data rate itself will be 10 Gbps.

It also supports a variety of media, including 850nm VCSEL/1310nm VCSEL/1550nm VCSEL/1310 FP/1310nm DFB/1550nm DFB/1310nm EML/1550nm EML/Coppers or Others and nine types.VCSEL stands for Vertical Cavity Surface Emitting Laser, FPL for FP Laser, DFB for Distributed Feedback Laser, and EML for Electro Absorption Modulator Laser.

As for Copper, is there a product that can withstand it?I thought that, but when I looked into it, there was a product such as "XFP Twinax Cable", and the area that can reach up to 10m may be used for wiring in racks, for example.

Back to the topic, since it supports so many wavelengths and laser systems, it can be used without problems for "10GBASE-R" and "10GBASE-X" defined by IEEE 802.3ae.

Power supply is the toughest point compared to XENPAK/X2.In the case of XFP, four types of modules of Power Level 1 to 4 are defined.

However, the power supplied is +1.8V/1.8W, +3.3V/2.5W, +5V/2.5W in the first place, and even if Power Level 4 is defined, the limit that can be used is 6.8W. Not as good as XENPAK/X2, which was capable of 10W.

Freelance technical writer.His expertise spans a wide range of fields, from CPUs, memories, and chipsets to communications, OS, databases, and medical-related fields.Homepage is http://www.yusuke-ohara.com/

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10Gbps serial communication standard "XFP", replaced by "SFP+"

"10GBASE-PR" used in 10Gbps FLET'S Hikari and au Hikari, "10GBASE-LRM" that can divert existing cables

What is the cable specification that realizes "10 times faster"?

Various standards such as "100BASE-FX" and "100BASE-SX" with different transmission distances at a maximum of 100Mbps

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Standardized as "10G-EPON" and "IEEE 802.3av" with access lines reaching 10Gbps

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[History and development of optical Ethernet] 10GBASE transceiver module standard transferred from XENPAK → X2 → XFP → SFP + [Net new technology] – INTERNET Watch

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